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1074023

Radiation-Hardened Electronics for Space Application Market - A Global and Regional Analysis: Focus on Platform, Manufacturing Technique, Material Type, Component, and Country - Analysis and Forecast, 2022-2032

Published: | BIS Research Inc. | 160 Pages | Delivery time: 1-2 business days

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Radiation-Hardened Electronics for Space Application Market - A Global and Regional Analysis: Focus on Platform, Manufacturing Technique, Material Type, Component, and Country - Analysis and Forecast, 2022-2032
Published: May 6, 2022
BIS Research Inc.
Content info: 160 Pages
Delivery time: 1-2 business days
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  • Table of Contents
  • List of Tables

“Global Radiation-Hardened Electronics for Space Application Market to Reach $4,761.1 Million by 2032.”

Industry & Technology Overview

Global Radiation-Hardened Electronics for Space Applications Market Overview

The global radiation-hardened electronics for space applications market is estimated to reach $4,761.1 million in 2032 from $2,348.0 million in 2021, at a growth rate of 1.70% during the forecast period. The growth in the global radiation-hardened electronics for space applications market is expected to be driven by increasing demand for communication and Earth observation satellites.

Market Lifecycle Stage

Over the past few years, there has been a drastic shift toward adopting small satellites over conventional ones. Moreover, the market has been witnessing a drift in the trend from using small satellites for one-time stints toward their regular use in satellite constellations. With the rapid growth in small satellite constellations for various applications such as Earth observation, remote sensing, and space-based broadband services, the demand for radiation-hardened electronic components has also significantly increased.

Several projects are currently in progress to produce advanced radiation-hardened electronics with enhanced capability to shield space perturbations at low cost, which are expected to increase with the launch of upcoming mega-constellations as well as with the rising interest of companies in satellite components that can sustain in the harsh space environment for longer period of time.

Various radiation-hardened electronics that are currently used are onboard computers, microprocessors and microcontrollers, power sources, memory (solid-state recorder), field-programmable gate array, transmitter, and receiver (antennas), application-specific integrated circuit, and sensors. Space is a huge market with unlimited opportunities, and radiation-hardened components are required across all platforms to function. As a result, the market for radiation-hardened electronics for space applications is well-established.

Impact

  • The increasing number of satellites in low Earth orbit (LEO) with the upcoming mega-constellation has placed a high demand for the production of space-based radiation-hardened components that are capable of withstanding high radiation effects caused due to solar flares.
  • Furthermore, rising interest among space agencies for long-term missions has resulted in the need for radiation-hardened components that can survive severe environments while also being compressed or miniaturized to support complex missions for significantly longer periods.

Market Segmentation:

Segmentation 1: by Platform

  • Satellite
  • Launch Vehicle
  • Deep Space Probe

Based on platforms, the global radiation-hardened electronics for space applications market in the platform segment is expected to be dominated by the satellite platform.

Segmentation 2: by Manufacturing Technique

  • Rad-Hard by Design
  • Rad-Hard by Process
  • Rad-Hard by Software

Based on manufacturing techniques, the global radiation-hardened electronics for space applications market is slightly more dominated by the rad-hard by design segment. Rad-hard by design manufacturing technique is expensive to manufacture, but the components provide extremely robust solutions and the highest radiation hardness rating that can be used for extreme space applications such as deep space missions and satellites.

Segmentation 3: by Material Type

  • Silicon
  • Gallium Nitride
  • Silicon Carbide
  • Others

The majority of the radiation-hardened components is made out of silicon because it helps in reducing the size and weight and improves the computation performance from medium to high speed.

Segmentation 4: by Component

  • Onboard Computer, Microprocessor, and Controller
  • Power Source
  • Memory (Solid-State Recorder)
  • Field-Programmable Gate Array
  • Transmitter and Receiver (Antennas)
  • Application-Specific Integrated Circuit
  • Sensor

Due to technological advancements, onboard computers, microprocessors, and controllers are expected to be used for new applications requiring increased efficiency, robust, and capable microprocessor technology, resulting in the deployment of highly sophisticated, demanding applications in smaller spaces.

Segmentation 5: by Region

  • North America - U.S., and Canada
  • Europe - France, Germany, Russia, U.K, and Rest-of-Europe
  • Asia-Pacific - China, Japan, India, and Rest-of-Asia-Pacific
  • Rest-of-the-World - Middle East and Africa, and South America

Recent Developments in Global Radiation-Hardened Electronics for Space Applications Market

  • In June 2020, GSI Technology partnered with NSF Center for space to build cost-effective radiation-hardened and modular computer systems for space-related efforts, from ground-based high-performance computing data centers to deep space missions.
  • In March 2021, Mercury systems signed a contract with NASA's Jet Propulsion Laboratory to provide solid-state data recorders for the science mission. The device would be installed in an Earth-imaging spectrometer instrument, which is scheduled to launch in 2022.
  • In August 2021, STMicroelectronics collaborated with Xilinx, Inc. to build a power solution for Xilinx radiation-tolerant field-programmable gate arrays (FPGA) with QML-V qualified voltage regulator.
  • In April 2021, Exxelia launched a high-performance space-graded resistor that meets the requirements of weapons platforms, modern electronic warfare, and a wide range of space applications.

Demand - Drivers and Limitations

Following are the drivers for the radiation-hardened electronics for space applications market:

  • Rising Demand for Radiation-Hardened Electronics Components in the Communication Satellite Segment
  • Technological Advancements in Microprocessors and FPGAs

Following are the challenges for the radiation-hardened electronics for space applications market:

  • High-Cost Development and Designing Associated with Radiation-Hardened Electronic Components
  • Impact of Electronics Components Shortage on the Global Space Industry

Following are the opportunities for the radiation-hardened electronics for the space applications market:

  • Adoption of New Materials to Manufacture Space Electronics

How can this report add value to an organization?

  • Product/Innovation Strategy: The product segment helps the reader understand the different types of radiation-hardened electronics available for deployment in the industries for space platforms, and their potential globally. Moreover, the study provides the reader a detailed understanding of the different radiation-hardened electronics by application (satellite, launch vehicle, deep space probe, and others), manufacturing technique (rad-hard by design, rad-hard by process, and rad-hard by software), material type (silicon, gallium nitride, silicon carbide, and others), and component (onboard, microprocessor and controller, power source, memory (solid-state recorder), field-programmable gate array, transmitter and receiver (antennas), application-specific integrated circuit, and sensor).
  • Growth/Marketing Strategy: The global radiation-hardened electronics for space application market has seen major development by key players operating in the market, such as business expansion, contracts, mergers, partnerships, collaborations, and joint ventures. The favored strategy for the companies has been contracts to strengthen their position in the radiation-hardened electronics for space applications market. For instance, in January 2022, Cobham Plc signed a contract with Lattice Semiconductor Corporation to qualify and sell radiation-tolerant field-programmable gate arrays (FPGAs) for satellite and space applications. The collaboration would allow Cobham to address the growing demand for an on-orbit reconfigurable payload system for upcoming satellites.
  • Competitive Strategy: Key players in the global radiation-hardened electronics for space applications market analyzed and profiled in the study involve radiation-hardened electronic product manufacturers that provide solar cells/arrays, microprocessors, memory, batteries, and power modules. Moreover, a detailed competitive benchmarking of the players operating in the global space radiation-hardened electronics for the space applications market has been done to help the reader understand how players stack against each other, presenting a clear market landscape. Additionally, comprehensive competitive strategies such as contracts, partnerships, agreements, acquisitions, and collaborations will aid the reader in understanding the untapped revenue pockets in the market.

Key Market Players and Competition Synopsis

The companies that are profiled have been selected based on inputs gathered from primary experts and analysis of the company's coverage, product portfolio, and market penetration.

The top segment players that lead the market include established players providing radiation-hardened electronics for space applications and constitute 80% of the presence in the market. Other players include start-up entities that account for approximately 20% of the presence in the market.

Some of the prominent names established in this market are:

  • 3D Plus
  • Analog Devices, Inc.
  • Apogee Semiconductor
  • Cobham Plc
  • Data Device Corporation
  • Exxelia
  • General Dynamics
  • GSI Technology, Inc.
  • Infineon Technologies
  • Mercury Systems, Inc.
  • Microchip Technology, Inc.
  • Micropac Industries
  • Renesas Electronics Corporation
  • Solid State Devices, Inc.
  • STMicroelectronics N.V.
  • Teledyne Technologies
  • Texas Instruments
  • Vorago Technologies
  • Xilinx, Inc.

Companies that are not a part of the previously mentioned pool have been well represented across different sections of the report (wherever applicable).

Product Code: DSM0670SC

Table of Contents

1 Markets

  • 1.1 Industry Outlook
    • 1.1.1 Radiation-Hardened Electronics for Space Applications Market: Overview
      • 1.1.1.1 New Space: An Emerging Business Opportunity from LEO-Focused Small Satellites and Deep Space Missions
    • 1.1.2 Comparison of Radiation-Hardened Products Standard Requirements (by End User)
    • 1.1.3 Ongoing Radiation Hardening Efforts in the Space Industry
      • 1.1.3.1 Davinci+
      • 1.1.3.2 Lunar Ice Cubes
      • 1.1.3.3 Psyche
      • 1.1.3.4 Jupiter Icy Moons Explorer (JUICE)
      • 1.1.3.5 Peregrine Mission 1
    • 1.1.4 Current and Futuristic Trends
      • 1.1.4.1 Machine Learning in Space-Graded FPGA
      • 1.1.4.2 Single Board Computer for Space Missions
      • 1.1.4.3 Artificial Intelligence-Based ARM Quad-Core Processor
      • 1.1.4.4 Radiation-Hardened Plastic Package Integrated Circuits
      • 1.1.4.5 Complementary Metal Oxide Semiconductor Image Sensor
    • 1.1.5 Radiation-Hardened Electronics Manufacturers and Certifications
    • 1.1.6 Supply Chain Analysis
  • 1.2 Business Dynamics
    • 1.2.1 Business Drivers
      • 1.2.1.1 Rising Demand for Radiation-Hardened Electronics Components in the Communication Satellite Segment
      • 1.2.1.2 Technological Advancements in Microprocessors and FPGAs
    • 1.2.2 Business Challenges
      • 1.2.2.1 High-Cost Development and Designing Associated with Radiation-Hardened Electronic Components
      • 1.2.2.2 Impact of Electronics Components Shortage on the Global Space Industry
    • 1.2.3 Business Strategies
      • 1.2.3.1 New Product Launch
    • 1.2.4 Corporate Strategies
      • 1.2.4.1 Partnerships, Collaborations, Agreements, and Contracts
      • 1.2.4.2 Mergers and Acquisitions
      • 1.2.4.3 Others
    • 1.2.5 Business Opportunities
      • 1.2.5.1 Adoption of New Materials to Manufacture Space Electronics

2 Application

  • 2.1 Global Radiation-Hardened Electronics for Space Applications Market - by Platform
    • 2.1.1 Market Overview
      • 2.1.1.1 Demand Analysis of Radiation-Hardened Electronics for Space Applications Market (by Platform)
    • 2.1.2 Satellite
      • 2.1.2.1 Small Satellites (0-500Kg)
      • 2.1.2.2 Medium Satellites (501-1,000Kg)
      • 2.1.2.3 Large Satellites (1,001Kg and Above)
        • 2.1.2.3.1 Demand Analysis of Satellite Market
    • 2.1.3 Launch Vehicle
      • 2.1.3.1 Small and Medium-Lift Launch Vehicle
      • 2.1.3.2 Heavy-Lift Launch Vehicles
        • 2.1.3.2.1 Demand Analysis of Launch Vehicle Market
    • 2.1.4 Deep Space Probe
      • 2.1.4.1 Lander
      • 2.1.4.2 Rover
      • 2.1.4.3 Orbiter

3 Products

  • 3.1 Global Radiation-Hardened Electronics for Space Applications Market - by Manufacturing Technique
    • 3.1.1 Market Overview
      • 3.1.1.1 Demand Analysis of Radiation-Hardened Electronics for Space Applications Market (by Manufacturing Technique)
    • 3.1.2 Rad-Hard by Design
      • 3.1.2.1 Total Ionization Dose
      • 3.1.2.2 Single Event Effect
    • 3.1.3 Rad-Hard by Process
      • 3.1.3.1 Silicon on Insulator
      • 3.1.3.2 Silicon on Sapphire
    • 3.1.4 Rad-Hard by Software
  • 3.2 Global Radiation-Hardened Electronics for Space Applications Market - by Material Type
    • 3.2.1 Market Overview
      • 3.2.1.1 Demand Analysis of Radiation-Hardened Electronics for Space Applications Market (by Material Type)
    • 3.2.2 Silicon
    • 3.2.3 Gallium Nitride
    • 3.2.4 Silicon Carbide
    • 3.2.5 Others
  • 3.3 Global Radiation-Hardened Electronics for Space Applications Market - by Component
    • 3.3.1 Market Overview
      • 3.3.1.1 Demand Analysis of Radiation-Hardened Electronics for Space Applications Market (by Component)
    • 3.3.2 Onboard Computer, Microprocessor, and Controller
    • 3.3.3 Power Source (Power Management Device, Solar Panel, Batteries, Convertors)
    • 3.3.4 Memory (Solid State Recorder)
    • 3.3.5 Field-Programmable Gate Array (FPGA)
    • 3.3.6 Transmitter and Receiver (Antennas)
    • 3.3.7 Application-Specific Integrated Circuit
    • 3.3.8 Sensor

4 Region

  • 4.1 Global Radiation-Hardened Electronics for Space Applications Market (by Region)
  • 4.2 North America
    • 4.2.1 Markets
      • 4.2.1.1 Key Manufacturers and Service Providers in North America
      • 4.2.1.2 Business Drivers
      • 4.2.1.3 Business Challenges
    • 4.2.2 Application
      • 4.2.2.1 North America Radiation-Hardened Electronics for Space Applications Market (by Platform)
    • 4.2.3 North America (by Country)
      • 4.2.3.1 U.S.
        • 4.2.3.1.1 Markets
          • 4.2.3.1.1.1 Key Manufacturers and Service Providers in the U.S.
        • 4.2.3.1.2 Application
          • 4.2.3.1.2.1 U.S. Radiation-Hardened Electronics for Space Applications Market (by Platform)
      • 4.2.3.2 Canada
        • 4.2.3.2.1 Markets
          • 4.2.3.2.1.1 Key Manufacturers in Canada
        • 4.2.3.2.2 Application
          • 4.2.3.2.2.1 Canada Radiation-Hardened Electronics for Space Applications Market (by Platform)
  • 4.3 Europe
    • 4.3.1 Markets
      • 4.3.1.1 Key Manufacturers and Service Providers in Europe
      • 4.3.1.2 Business Drivers
      • 4.3.1.3 Business Challenges
    • 4.3.2 Application
      • 4.3.2.1 Europe Radiation-Hardened Electronics for Space Applications Market (by Platform)
    • 4.3.3 Europe (by Country)
      • 4.3.3.1 France
        • 4.3.3.1.1 Markets
          • 4.3.3.1.1.1 Key Manufacturers and Service Providers in France
        • 4.3.3.1.2 Application
          • 4.3.3.1.2.1 France Radiation-Hardened Electronics for Space Applications Market (by Platform)
      • 4.3.3.2 Germany
        • 4.3.3.2.1 Key Manufacturers and Service Providers in Germany
        • 4.3.3.2.2 Application
          • 4.3.3.2.2.1 Germany Radiation-Hardened Electronics for Space Applications Market (by Platform)
      • 4.3.3.3 Russia
        • 4.3.3.3.1 Application
          • 4.3.3.3.1.1 Russia Radiation-Hardened Electronics for Space Applications Market (by Platform)
      • 4.3.3.4 U.K.
        • 4.3.3.4.1 Markets
          • 4.3.3.4.1.1 Key Manufacturers and Service Providers in the U.K.
        • 4.3.3.4.2 Application
          • 4.3.3.4.2.1 U.K. Radiation-Hardened Electronics for Space Applications Market (by Platform)
      • 4.3.3.5 Rest-of-Europe
        • 4.3.3.5.1 Markets
          • 4.3.3.5.1.1 Key Manufacturers and Service Providers in the Rest-of-Europe
        • 4.3.3.5.2 Application
          • 4.3.3.5.2.1 Rest-of-Europe Radiation-Hardened Electronics for Space Applications Market (by Platform)
  • 4.4 Asia-Pacific
    • 4.4.1 Markets
      • 4.4.1.1 Key Manufacturers and Service Providers in Asia-Pacific
      • 4.4.1.2 Business Drivers
      • 4.4.1.3 Business Challenges
    • 4.4.2 Application
      • 4.4.2.1 Asia-Pacific Radiation-Hardened Electronics for Space Applications Market (by Platform)
    • 4.4.3 Asia-Pacific (by Country)
      • 4.4.3.1 China
        • 4.4.3.1.1 Application
          • 4.4.3.1.1.1 China Radiation-Hardened Electronics for Space Applications Market (by Platform)
      • 4.4.3.2 India
        • 4.4.3.2.1 Application
          • 4.4.3.2.1.1 India Radiation-Hardened Electronics for Space Applications Market (by Platform)
      • 4.4.3.3 Japan
        • 4.4.3.3.1 Markets
          • 4.4.3.3.1.1 Key Manufacturers and Service Providers in Japan
        • 4.4.3.3.2 Application
          • 4.4.3.3.2.1 Japan Radiation-Hardened Electronics for Space Applications Market (by Platform)
      • 4.4.3.4 Rest-of-Asia-Pacific
        • 4.4.3.4.1 Application
          • 4.4.3.4.1.1 Rest-of-Asia-Pacific Radiation-Hardened Electronics for Space Applications Market (by Platform)
    • 4.4.4 Rest-of-the-World (by Country)
    • 4.4.5 Markets
      • 4.4.5.1 Key Manufacturers and Service Providers in Rest-of-the-World
      • 4.4.5.2 Business Drivers
      • 4.4.5.3 Business Challenges
    • 4.4.6 Application
      • 4.4.6.1 Rest-of-the-World Radiation-Hardened Electronics for Space Applications Market (by Application)
    • 4.4.7 Rest-of-the-World (by Country)
      • 4.4.7.1 Middle East and Africa
        • 4.4.7.1.1 Markets
      • 4.4.7.2 Key Manufacturers and Service Providers in the Middle East and Africa
          • 4.4.7.2.1.1 Middle East and Africa Radiation-Hardened Electronics for Space Applications Market
      • 4.4.7.3 South America
          • 4.4.7.3.1.1 South America Radiation-Hardened Electronics for Space Applications Market

5 Market - Market Share Analysis & Company Profiles

  • 5.1 Market Share Analysis
  • 5.2 3D Plus
    • 5.2.1 Company Overview
      • 5.2.1.1 Role of 3D Plus in the Radiation-Hardened Electronics for Space Applications Market
      • 5.2.1.2 Product Portfolio
    • 5.2.2 Business Strategies
      • 5.2.2.1 New Product Launch
    • 5.2.3 Analyst View
  • 5.3 Analog Devices, Inc.
    • 5.3.1 Company Overview
      • 5.3.1.1 Role of Analog Devices, Inc. in the Radiation-Hardened Electronics for Space Applications Market
      • 5.3.1.2 Product Portfolio
    • 5.3.2 Corporate Strategies
      • 5.3.2.1 Mergers and Acquisition
    • 5.3.3 Analyst View
  • 5.4 Apogee Semiconductor
    • 5.4.1 Company Overview
      • 5.4.1.1 Role of Apogee Semiconductor in the Radiation-Hardened Electronics for Space Applications Market
      • 5.4.1.2 Product Portfolio
    • 5.4.2 Corporate Strategies
      • 5.4.2.1 Partnerships, Collaborations, Agreements, Investments, and Contracts
    • 5.4.3 Analyst View
  • 5.5 Cobham Plc
    • 5.5.1 Company Overview
      • 5.5.1.1 Role of Cobham Plc in the Radiation-Hardened Electronics for Space Applications Market
      • 5.5.1.2 Product Portfolio
    • 5.5.2 Corporate Strategies
      • 5.5.2.1 Partnerships, Collaborations, Agreements, Investments, and Contracts
    • 5.5.3 Analyst View
  • 5.6 Data Device Corporation
    • 5.6.1 Company Overview
      • 5.6.1.1 Role of Data Device Corporation in the Radiation-Hardened Electronics for Space Applications Market
      • 5.6.1.2 Product Portfolio
    • 5.6.2 Corporate Strategies
      • 5.6.2.1 Partnerships, Collaborations, Agreements, Investments, and Contracts
    • 5.6.3 Analyst View
  • 5.7 Exxelia
    • 5.7.1 Company Overview
      • 5.7.1.1 Role of Exxelia in the Radiation-Hardened Electronics for Space Applications Market
      • 5.7.1.2 Product Portfolio
    • 5.7.2 Business Strategies
      • 5.7.2.1 New Product Launch
    • 5.7.3 Analyst View
  • 5.8 General Dynamics
    • 5.8.1 Company Overview
      • 5.8.1.1 Role of General Dynamics in the Radiation-Hardened Electronics for Space Applications Market
      • 5.8.1.2 Product Portfolio
    • 5.8.2 Analyst View
  • 5.9 GSI Technology, Inc.
    • 5.9.1 Company Overview
      • 5.9.1.1 Role of GSI Technology, Inc. in the Radiation-Hardened Electronics for Space Applications Market
      • 5.9.1.2 Product Portfolio
    • 5.9.2 Corporate Strategies
      • 5.9.2.1 Partnerships, Collaborations, Agreements, Investments, and Contracts
    • 5.9.3 Analyst View
  • 5.1 Infineon Technologies
    • 5.10.1 Company Overview
      • 5.10.1.1 Role of Infineon Technologies in the Radiation-Hardened Electronics for Space Applications Market
      • 5.10.1.2 Product Portfolio
    • 5.10.2 Analyst View
  • 5.11 Mercury Systems, Inc.
    • 5.11.1 Company Overview
      • 5.11.1.1 Role of Mercury Systems, Inc. in the Radiation-Hardened Electronics for Space Applications Market
      • 5.11.1.2 Product Portfolio
    • 5.11.2 Corporate Strategies
      • 5.11.2.1 Partnerships, Collaborations, Agreements, Investments, and Contracts
    • 5.11.3 Analyst View
  • 5.12 Microchip Technology, Inc.
    • 5.12.1 Company Overview
      • 5.12.1.1 Role of Microchip Technology, Inc. in Radiation-Hardened Electronics for Space Applications Market
      • 5.12.1.2 Product Portfolio
    • 5.12.2 Analyst View
  • 5.13 Micropac Industries
    • 5.13.1 Company Overview
      • 5.13.1.1 Role of Micropac Industries in the Radiation-Hardened Electronics for Space Applications Market
      • 5.13.1.2 Product Portfolio
    • 5.13.2 Analyst View
  • 5.14 Renesas Electronics Corporation
    • 5.14.1 Company Overview
      • 5.14.1.1 Role of Renesas Electronics Corporation in the Radiation-Hardened Electronics for Space Applications Market
      • 5.14.1.2 Product Portfolio
    • 5.14.2 Analyst View
  • 5.15 Solid State Devices, Inc.
    • 5.15.1 Company Overview
      • 5.15.1.1 Role of Solid State Devices, Inc. in the Radiation-Hardened Electronics for Space Applications Market
      • 5.15.1.2 Product Portfolio
    • 5.15.2 Analyst View
  • 5.16 STMicroelectronics N.V.
    • 5.16.1 Company Overview
      • 5.16.1.1 Role of STMicroelectronics N.V. in the Radiation-Hardened Electronics for Space Applications Market
      • 5.16.1.2 Product Portfolio
    • 5.16.2 Corporate Strategies
      • 5.16.2.1 Partnerships, Collaborations, Agreements, Investments, and Contracts
    • 5.16.3 Analyst View
  • 5.17 Teledyne Technologies
    • 5.17.1 Company Overview
      • 5.17.1.1 Role of Teledyne Technologies in the Radiation-Hardened Electronics for Space Applications Market
      • 5.17.1.2 Product Portfolio
    • 5.17.2 Analyst View
  • 5.18 Texas Instruments
    • 5.18.1 Company Overview
      • 5.18.1.1 Role of Texas Instruments in the Radiation-Hardened Electronics for Space Applications Market
      • 5.18.1.2 Product Portfolio
    • 5.18.2 Analyst View
  • 5.19 Vorago Technologies
    • 5.19.1 Company Overview
      • 5.19.1.1 Role of Vorago Technologies in the Radiation-Hardened Electronics for Space Applications Market
      • 5.19.1.2 Product Portfolio
    • 5.19.2 Analyst View
  • 5.2 Xilinx, Inc.
    • 5.20.1 Company Overview
      • 5.20.1.1 Role of Xilinx, Inc. in the Radiation-Hardened Electronics for Space Applications Market
      • 5.20.1.2 Product Portfolio
    • 5.20.2 Analyst View
  • 5.21 Other Key Players
    • 5.21.1 ON Semiconductor
      • 5.21.1.1 Company Overview
    • 5.21.2 TE Connectivity
      • 5.21.2.1 Company Overview

6 Growth Opportunities and Recommendations

  • 6.1 Growth Opportunities
  • 6.2 Recommendations

7 Research Methodology

  • 7.1 Factors for Data Prediction and Modeling

List of Figures

  • Figure 1: Global Radiation-Hardened Electronics for Space Applications Market, Units, 2021-2032
  • Figure 2: Global Radiation-Hardened Electronics for Space Applications Market, $Million, 2021-2032
  • Figure 3: Global Radiation-Hardened Electronics for Space Applications Market (by Platform), Units, 2021 and 2032
  • Figure 4: Global Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million, 2021 and 2032
  • Figure 5: Global Radiation-Hardened Electronics for Space Applications Market (by Manufacturing Technique), $Million, 2021 and 2032
  • Figure 6: Global Radiation-Hardened Electronics for Space Applications Market (by Component), $Million, 2021 and 2032
  • Figure 7: Global Radiation-Hardened Electronics for Space Applications Market (by Material), Value, 2021 and 2032
  • Figure 8: Global Radiation-Hardened Electronics for Space Applications Market (by Region), $Million, 2021
  • Figure 9: Radiation-Hardened Electronics for Space Applications Market Coverage
  • Figure 10: Small Satellite Scenario (0-2,200 kg), 2021-2027
  • Figure 11: Supply Chain Analysis of Radiation-Hardened Electronics for Space Applications Market
  • Figure 12: Global Radiation-Hardened Electronics for Space Applications Market, Business Dynamics
  • Figure 13: Share of Key Business Strategies and Developments, 2019-2022
  • Figure 14: Radiation-Hardened Electronics for Space Applications (by Satellite)
  • Figure 15: Radiation-Hardened Electronics for Space Applications (by Launch Vehicle)
  • Figure 16: Radiation-Hardened Electronics for Space Applications Market (by Deep Space Probe)
  • Figure 17: Global Radiation-Hardened Electronics for the Space Applications Market: Market Share Analysis, 2021
  • Figure 18: Research Methodology
  • Figure 19: Top-Down and Bottom-Up Approach
  • Figure 20: Assumptions and Limitations

List of Tables

  • Table 1: Expected Launches of Small Satellite Constellations by 2027
  • Table 2: Upcoming Space Missions:
  • Table 3: End-User Specifications
  • Table 4: List of Certifications for Space Applications
  • Table 5: New Product Launch, 2019-2022
  • Table 6: Partnerships, Collaborations, Agreements and Contracts, 2019-2022
  • Table 7: Mergers and Acquisitions, 2019-2022
  • Table 8: Others, 2019-2022
  • Table 9: Global Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 10: Radiation-Hardened Electronics for Space Applications Market (by Satellite), $Million and Units, 2021-2032
  • Table 11: Radiation-Hardened Electronics for Space Applications Market (by Launch Vehicle), Value ($Million) and Volume (Number of Units), 2021-2032
  • Table 12: Global Radiation-Hardened Electronics for Space Applications Market (by Manufacturing Technique), $Million, 2021-2032
  • Table 13: Global Radiation-Hardened Electronics for Space Applications Market (by Material Type), $Million, 2021-2032
  • Table 14: Global Radiation-Hardened Electronics for Space Applications Market (by Component), Value ($Million) and Volume (Number of Units), 2021-2032
  • Table 15: Global Radiation-Hardened Electronics for Space Applications Market (by Region), $Million and Units, 2021-2032
  • Table 16: North America Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 17: U.S. Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 18: Canada Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 19: Europe Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 20: France Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 21: Germany Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 22: Russia Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 23: U.K. Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 24: Rest-of-Europe Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 25: Asia-Pacific Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 26: China Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 27: India Radiation hardened Components for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 28: Japan Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 29: Rest-of-Asia-Pacific Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 30: Rest-of-the-World Radiation-Hardened Electronics for Space Applications Market (by Platform), $Million and Units, 2021-2032
  • Table 31: Middle East and Africa Radiation-Hardened Electronics for Space Applications Market, $Million and Units, 2021-2032
  • Table 32: South America Radiation-Hardened Electronics for Space Applications Market, $Million and Units, 2021-2032
  • Table 33: 3D Plus: Product Portfolio
  • Table 34: New Product Launch
  • Table 35: Analog Devices, Inc.: Product Portfolio
  • Table 36: Analog Devices, Inc.: Merger and Acquisition
  • Table 37: Apogee Semiconductors: Product Portfolio
  • Table 38: Apogee Semiconductors: Partnerships, Collaborations, Agreements, Investments, and Contracts
  • Table 39: Cobham Plc: Product Portfolio
  • Table 40: Cobham Plc: Partnerships, Collaborations, Agreements, Investments, and Contracts
  • Table 41: Data Device Corporation: Product Portfolio
  • Table 42: Data Device Corporation: Partnerships, Collaborations, Agreements, Investments, and Contracts
  • Table 43: Exxelia: Product Portfolio
  • Table 44: Exxelia: New Product Launch
  • Table 45: General Dynamics: Product Portfolio
  • Table 46: Geospatial Insight: Product Portfolio
  • Table 47: GSI Technology, Inc.: Partnerships, Collaborations, Agreements, Investments, and Contracts
  • Table 48: Infineon Technologies: Product Portfolio
  • Table 49: Mercury Systems, Inc.: Product Portfolio
  • Table 50: Mercury Systems Inc.: Partnerships, Collaborations, Agreements, Investments, and Contracts
  • Table 51: Microchip Technology, Inc.: Product Portfolio
  • Table 52: Micropac Industries: Product Portfolio
  • Table 53: Renesas Electronics Corporation: Product Portfolio
  • Table 54: Solid State Devices, Inc.: Product Portfolio
  • Table 55: STMicroelectronics N.V.: Product Portfolio
  • Table 56: STMicroelectronics N.V.: Partnerships, Collaborations, Agreements, Investments, and Contracts
  • Table 57: Teledyne Technologies: Product Portfolio
  • Table 58: Texas Instruments: Product Portfolio
  • Table 59: Vorago Technologies: Product Portfolio
  • Table 60: Xilinx, Inc.: Product Portfolio