Global Interconnects and Passive Components Market Size Study & Forecast, by Passive Components, Interconnect Type, and Application, and Regional Forecasts 2025-2035

Description

The Global Interconnects and Passive Components Market is valued approximately at USD 204.46 billion in 2024 and is anticipated to grow with a CAGR of more than 4.41% over the forecast period of 2025-2035. Interconnects and passive components form the foundational backbone of modern electronics-acting as the silent enablers of signal transmission, filtering, power regulation, and impedance matching in everything from consumer gadgets to advanced industrial machinery. The market's growth trajectory is propelled by the sweeping penetration of electronics across automotive systems, telecommunications, consumer devices, and the expanding realm of industrial automation. As industries continue to digitalize and miniaturize, the demand for compact, high-efficiency, and thermally stable passive and interconnect components has accelerated at a remarkable pace. Moreover, technological convergence across IoT, 5G, and electric mobility has further strengthened the adoption landscape for these components, making them indispensable in next-generation circuit architectures.

The surge in demand for connected devices and energy-efficient electronic systems has substantially expanded the scope of interconnect and passive component utilization. These components are central to managing signal integrity, electromagnetic compatibility, and power optimization across circuits. According to the International Federation of Robotics, global industrial robot installations are projected to exceed 700,000 units annually by 2025, underscoring the pivotal role of advanced interconnects and passive components in supporting automation ecosystems. Additionally, the proliferation of electric and hybrid vehicles has significantly boosted the consumption of high-voltage connectors, robust resistors, and specialized inductors. However, the rising cost of raw materials and supply chain disruptions pose constraints, especially for manufacturers reliant on rare-earth materials and specialty alloys. Despite these challenges, the relentless innovation in materials science and surface-mount technology continues to unlock fresh avenues for scalability and performance enhancement.

The detailed segments and sub-segments included in the report are:

By Passive Components:

Resistor
Capacitor
Inductor
Transformer
Diode

By Interconnect Type:

PCB
Connector
Switch
Relay
Adapter
Terminal
Splice
Socket

By Application:

Consumer Electronics
Automotive
Industrial
Telecommunications
Aerospace & Defense
Healthcare
Others

By Region:

North America

U.S.
Canada

Europe

UK
Germany
France
Spain
Italy
Rest of Europe

Asia Pacific

China
India
Japan
South Korea
Australia
Rest of Asia Pacific

Latin America

Brazil
Mexico

Middle East & Africa

UAE
Saudi Arabia
South Africa
Rest of Middle East & Africa

Passive Components Segment to Dominate the Market

Among the two primary categories, the Passive Components segment is expected to dominate the global market during the forecast period. Resistors, capacitors, and inductors serve as essential building blocks in virtually every electronic circuit, accounting for a substantial portion of total component consumption worldwide. Capacitors alone, particularly multilayer ceramic capacitors (MLCCs), have witnessed exponential demand across consumer electronics and automotive sectors. The growing miniaturization of devices, coupled with the proliferation of wearable technologies and edge computing hardware, has amplified the need for compact yet high-capacity passive components. Meanwhile, resistors and inductors are benefitting from innovations in thin-film technology and energy-efficient designs, supporting the ongoing transition toward low-power electronic ecosystems.

Interconnect Type Segment Leads in Revenue Contribution

In terms of revenue, the Interconnect Type segment-comprising PCBs, connectors, switches, and relays-holds the lion's share of the market. Connectors and printed circuit boards (PCBs) are integral to high-speed data transmission and device integrity across a multitude of sectors, from telecommunications infrastructure to next-generation automotive infotainment systems. The industry is witnessing a rapid transition toward high-density interconnect (HDI) PCBs and fiber-optic connectors designed to accommodate growing bandwidth demands. Moreover, relays and switches are experiencing surging adoption in industrial automation and power distribution applications. While the Passive Components segment underpins the electronic core, the Interconnect segment drives commercial profitability due to its critical role in enabling system reliability and modular scalability.

The key regions considered for the Global Interconnects and Passive Components Market study include Asia Pacific, North America, Europe, Latin America, and the Middle East & Africa. North America dominates the market in 2025, credited to the presence of a robust semiconductor industry, heavy R&D investments, and the accelerating adoption of IoT-enabled smart devices. The U.S. leads with strong integration of these components in aerospace, defense, and automotive systems. Europe follows closely, benefiting from stringent energy efficiency regulations and the presence of leading automotive OEMs incorporating high-performance passive components. However, Asia Pacific is anticipated to register the fastest growth rate during 2025-2035, driven by escalating electronics manufacturing in China, Japan, and South Korea. Rapid industrialization, coupled with government-backed incentives for semiconductor fabrication and electric vehicle production, continues to strengthen the region's dominance in global supply chains.

Major market players included in this report are:

Murata Manufacturing Co., Ltd.
TE Connectivity Ltd.
TDK Corporation
Vishay Intertechnology Inc.
Amphenol Corporation
Yageo Corporation
Panasonic Holdings Corporation
Molex LLC
AVX Corporation
Kyocera AVX Components Corporation
Samsung Electro-Mechanics Co., Ltd.
Omron Corporation
Littelfuse, Inc.
ROHM Semiconductor
Walsin Technology Corporation

Global Interconnects and Passive Components Market Report Scope:

Historical Data - 2023, 2024
Base Year for Estimation - 2024
Forecast period - 2025-2035
Report Coverage - Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Regional Scope - North America; Europe; Asia Pacific; Latin America; Middle East & Africa
Customization Scope - Free report customization (equivalent to up to 8 analysts' working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments and countries in recent years and to forecast their values for the coming decade. The report integrates both qualitative and quantitative aspects of the industry, evaluating growth drivers, restraints, and opportunities that will shape its trajectory. It also presents micro-market opportunities for stakeholders and a detailed examination of the competitive landscape, business strategies, and product offerings of key players. The detailed segments and sub-segments of the market are elucidated above.

Key Takeaways:

Market Estimates & Forecast for 10 years from 2025 to 2035.
Annualized revenues and regional-level analysis for each market segment.
Detailed analysis of the geographical landscape with country-level insights.
Competitive landscape with profiles of key market players.
Strategic recommendations on future market approach.
Evaluation of the market's competitive structure.
Comprehensive demand-side and supply-side analysis.

Chapter 1. Global Interconnects and Passive Components Market Report Scope & Methodology

1.1. Research Objective
1.2. Research Methodology
- 1.2.1. Forecast Model
- 1.2.2. Desk Research
- 1.2.3. Top Down and Bottom-Up Approach
1.3. Research Attributes
1.4. Scope of the Study
- 1.4.1. Market Definition
- 1.4.2. Market Segmentation
1.5. Research Assumption
- 1.5.1. Inclusion & Exclusion
- 1.5.2. Limitations
- 1.5.3. Years Considered for the Study

Chapter 2. Executive Summary

2.1. CEO/CXO Standpoint
2.2. Strategic Insights
2.3. ESG Analysis
2.4. key Findings

Chapter 3. Global Interconnects and Passive Components Market Forces Analysis

3.1. Market Forces Shaping The Global Interconnects and Passive Components Market (2024-2035)
3.2. Drivers
- 3.2.1. sweeping penetration of electronics across automotive systems
- 3.2.2. demand for compact, high-efficiency, and thermally stable passive and interconnect components
3.3. Restraints
- 3.3.1. rising cost of raw materials and supply chain disruptions
3.4. Opportunities
- 3.4.1. relentless innovation in materials science and surface-mount technology

Chapter 4. Global Interconnects and Passive Components Industry Analysis

4.1. Porter's 5 Forces Model
- 4.1.1. Bargaining Power of Buyer
- 4.1.2. Bargaining Power of Supplier
- 4.1.3. Threat of New Entrants
- 4.1.4. Threat of Substitutes
- 4.1.5. Competitive Rivalry
4.2. Porter's 5 Force Forecast Model (2024-2035)
4.3. PESTEL Analysis
- 4.3.1. Political
- 4.3.2. Economical
- 4.3.3. Social
- 4.3.4. Technological
- 4.3.5. Environmental
- 4.3.6. Legal
4.4. Top Investment Opportunities
4.5. Top Winning Strategies (2025)
4.6. Market Share Analysis (2024-2025)
4.7. Global Pricing Analysis And Trends 2025
4.8. Analyst Recommendation & Conclusion

Chapter 5. Global Interconnects and Passive Components Market Size & Forecasts by Passive Components 2025-2035

5.1. Market Overview
5.2. Global Interconnects and Passive Components Market Performance - Potential Analysis (2025)
5.3. Resistor
- 5.3.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 5.3.2. Market size analysis, by region, 2025-2035
5.4. Capacitor
- 5.4.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 5.4.2. Market size analysis, by region, 2025-2035
5.5. Inductor
- 5.5.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 5.5.2. Market size analysis, by region, 2025-2035
5.6. Transformer
- 5.6.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 5.6.2. Market size analysis, by region, 2025-2035
5.7. Diode
- 5.7.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 5.7.2. Market size analysis, by region, 2025-2035

Chapter 6. Global Interconnects and Passive Components Market Size & Forecasts by Interconnect Type 2025-2035

6.1. Market Overview
6.2. Global Interconnects and Passive Components Market Performance - Potential Analysis (2025)
6.3. PCB
- 6.3.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 6.3.2. Market size analysis, by region, 2025-2035
6.4. Connector
- 6.4.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 6.4.2. Market size analysis, by region, 2025-2035
6.5. Switch
- 6.5.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 6.5.2. Market size analysis, by region, 2025-2035
6.6. Relay
- 6.6.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 6.6.2. Market size analysis, by region, 2025-2035
6.7. Adapter
- 6.7.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 6.7.2. Market size analysis, by region, 2025-2035
6.8. Terminal
- 6.8.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 6.8.2. Market size analysis, by region, 2025-2035
6.9. Splice
- 6.9.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 6.9.2. Market size analysis, by region, 2025-2035
6.10. Socket
- 6.10.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 6.10.2. Market size analysis, by region, 2025-2035

Chapter 7. Global Interconnects and Passive Components Market Size & Forecasts by Application 2025-2035

7.1. Market Overview
7.2. Global Interconnects and Passive Components Market Performance - Potential Analysis (2025)
7.3. Consumer Electronics
- 7.3.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 7.3.2. Market size analysis, by region, 2025-2035
7.4. Automotive
- 7.4.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 7.4.2. Market size analysis, by region, 2025-2035
7.5. Industrial
- 7.5.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 7.5.2. Market size analysis, by region, 2025-2035
7.6. Telecommunications
- 7.6.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 7.6.2. Market size analysis, by region, 2025-2035
7.7. Aerospace & Defense
- 7.7.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 7.7.2. Market size analysis, by region, 2025-2035
7.8. Healthcare
- 7.8.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 7.8.2. Market size analysis, by region, 2025-2035
7.9. Others
- 7.9.1. Top Countries Breakdown Estimates & Forecasts, 2024-2035
- 7.9.2. Market size analysis, by region, 2025-2035

Chapter 8. Global Interconnects and Passive Components Market Size & Forecasts by Region 2025-2035

8.1. Growth Interconnects and Passive Components Market, Regional Market Snapshot
8.2. Top Leading & Emerging Countries
8.3. North America Interconnects and Passive Components Market
- 8.3.1. U.S. Interconnects and Passive Components Market
  - 8.3.1.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.3.1.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.3.1.3. Application breakdown size & forecasts, 2025-2035
- 8.3.2. Canada Interconnects and Passive Components Market
  - 8.3.2.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.3.2.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.3.2.3. Application breakdown size & forecasts, 2025-2035
8.4. Europe Interconnects and Passive Components Market
- 8.4.1. UK Interconnects and Passive Components Market
  - 8.4.1.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.4.1.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.4.1.3. Application breakdown size & forecasts, 2025-2035
- 8.4.2. Germany Interconnects and Passive Components Market
  - 8.4.2.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.4.2.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.4.2.3. Application breakdown size & forecasts, 2025-2035
- 8.4.3. France Interconnects and Passive Components Market
  - 8.4.3.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.4.3.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.4.3.3. Application breakdown size & forecasts, 2025-2035
- 8.4.4. Spain Interconnects and Passive Components Market
  - 8.4.4.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.4.4.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.4.4.3. Application breakdown size & forecasts, 2025-2035
- 8.4.5. Italy Interconnects and Passive Components Market
  - 8.4.5.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.4.5.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.4.5.3. Application breakdown size & forecasts, 2025-2035
- 8.4.6. Rest of Europe Interconnects and Passive Components Market
  - 8.4.6.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.4.6.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.4.6.3. Application breakdown size & forecasts, 2025-2035
8.5. Asia Pacific Interconnects and Passive Components Market
- 8.5.1. China Interconnects and Passive Components Market
  - 8.5.1.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.5.1.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.5.1.3. Application breakdown size & forecasts, 2025-2035
- 8.5.2. India Interconnects and Passive Components Market
  - 8.5.2.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.5.2.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.5.2.3. Application breakdown size & forecasts, 2025-2035
- 8.5.3. Japan Interconnects and Passive Components Market
  - 8.5.3.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.5.3.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.5.3.3. Application breakdown size & forecasts, 2025-2035
- 8.5.4. Australia Interconnects and Passive Components Market
  - 8.5.4.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.5.4.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.5.4.3. Application breakdown size & forecasts, 2025-2035
- 8.5.5. South Korea Interconnects and Passive Components Market
  - 8.5.5.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.5.5.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.5.5.3. Application breakdown size & forecasts, 2025-2035
- 8.5.6. Rest of APAC Interconnects and Passive Components Market
  - 8.5.6.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.5.6.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.5.6.3. Application breakdown size & forecasts, 2025-2035
8.6. Latin America Interconnects and Passive Components Market
- 8.6.1. Brazil Interconnects and Passive Components Market
  - 8.6.1.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.6.1.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.6.1.3. Application breakdown size & forecasts, 2025-2035
- 8.6.2. Mexico Interconnects and Passive Components Market
  - 8.6.2.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.6.2.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.6.2.3. Application breakdown size & forecasts, 2025-2035
8.7. Middle East and Africa Interconnects and Passive Components Market
- 8.7.1. UAE Interconnects and Passive Components Market
  - 8.7.1.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.7.1.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.7.1.3. Application breakdown size & forecasts, 2025-2035
- 8.7.2. Saudi Arabia (KSA) Interconnects and Passive Components Market
  - 8.7.2.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.7.2.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.7.2.3. Application breakdown size & forecasts, 2025-2035
- 8.7.3. South Africa Interconnects and Passive Components Market
  - 8.7.3.1. Passive components breakdown size & forecasts, 2025-2035
  - 8.7.3.2. Interconnect type breakdown size & forecasts, 2025-2035
  - 8.7.3.3. Application breakdown size & forecasts, 2025-2035

Chapter 9. Competitive Intelligence

9.1. Top Market Strategies
9.2. Murata Manufacturing Co., Ltd.
- 9.2.1. Company Overview
- 9.2.2. Key Executives
- 9.2.3. Company Snapshot
- 9.2.4. Financial Performance (Subject to Data Availability)
- 9.2.5. Product/Services Port
- 9.2.6. Recent Development
- 9.2.7. Market Strategies
- 9.2.8. SWOT Analysis
9.3. TE Connectivity Ltd.
9.4. TDK Corporation
9.5. Vishay Intertechnology Inc.
9.6. Amphenol Corporation
9.7. Yageo Corporation
9.8. Panasonic Holdings Corporation
9.9. Molex LLC
9.10. AVX Corporation
9.11. Kyocera AVX Components Corporation
9.12. Samsung Electro-Mechanics Co., Ltd.
9.13. Omron Corporation
9.14. Littelfuse, Inc.
9.15. ROHM Semiconductor
9.16. Walsin Technology Corporation