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Market Research Report

Global NAND Flash Market 2018-2022

Published by TechNavio (Infiniti Research Ltd.) Product code 232733
Published Content info 138 Pages
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Global NAND Flash Market 2018-2022
Published: January 9, 2018 Content info: 138 Pages
Description

About NAND Flash

NAND Flash memory is a type of non-volatile memory, wherein the read and write operations are quick. In NAND flash, the cells are connected in a series that resembles a NAND gate.

Technavio's analysts forecast the global NAND flash market to grow at a CAGR of 15.13% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global NAND flash market for 2018-2022. To calculate the market size, the report considers the revenue generated from the sales of NAND flash.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global NAND Flash Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • SAMSUNG
  • Toshiba
  • Western Digital
  • Micron Technology
  • SK Hynix
  • Intel

Market driver

  • Growing adoption of smartphones and tablets
  • For a full, detailed list, view our report

Market trend

  • Increasing popularity of 3D NAND
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents
Product Code: IRTNTR20286

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: INTRODUCTION

  • Market outline

PART 05: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 06: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 07: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 08: MARKET SEGMENTATION BY APPLICATION

  • Comparison by application
  • Smartphones - Market size and forecast 2017-2022
  • SSD - Market size and forecast 2017-2022
  • Memory cards - Market size and forecast 2017-2022
  • Tablets - Market size and forecast 2017-2022
  • Others - Market size and forecast 2017-2022
  • Market opportunity by application

PART 09: MARKET SEGMENTATION BY TECHNOLOGY

  • Segmentation by technology
  • Comparison by technology
  • TLC- Market size and forecast 2017-2022
  • MLC - Market size and forecast 2017-2022
  • SLC - Market size and forecast 2017-2022
  • Market opportunity by application

PART 10: MARKET SEGMENTATION BY TYPE

  • Segmentation by type
  • Comparison by type
  • 2D NAND - Market size and forecast 2017-2022
  • 3D NAND - Market size and forecast 2017-2022
  • Market opportunity by type

PART 11: CUSTOMER LANDSCAPE

PART 12: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • APAC - Market size and forecast 2017-2022
  • Americas - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • Key leading countries
  • Market opportunity

PART 13: DECISION FRAMEWORK

PART 14: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 15: MARKET TRENDS

  • Growing popularity of 3D NAND
  • Growing popularity of IoT
  • Evolution of signal processing technology in NAND flash market
  • Fluctuation in price of NAND flash

PART 16: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 17: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • SAMSUNG
  • Toshiba
  • Western Digital
  • Micron Technology
  • SK Hynix
  • Intel

PART 18: APPENDIX

  • List of abbreviations

List of Exhibits

  • Exhibit 01: Comparison of NOR and NAND flash memories
  • Exhibit 02: Classification of semiconductor memory
  • Exhibit 03: Parent market
  • Exhibit 04: Global memory module market
  • Exhibit 05: Market characteristics
  • Exhibit 06: Market segments
  • Exhibit 07: Market definition - Inclusions and exclusions checklist
  • Exhibit 08: Market size 2017
  • Exhibit 09: Validation techniques employed for market sizing 2017
  • Exhibit 10: Global - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 11: Global - Year-over-year growth 2018-2022 (%)
  • Exhibit 12: Five forces analysis 2017
  • Exhibit 13: Five forces analysis 2022
  • Exhibit 14: Bargaining power of buyers
  • Exhibit 15: Bargaining power of suppliers
  • Exhibit 16: Threat of new entrants
  • Exhibit 17: Threat of substitutes
  • Exhibit 18: Threat of rivalry
  • Exhibit 19: Market condition - Five forces 2017
  • Exhibit 20: Application- Market share 2017-2022 (% share)
  • Exhibit 21: Comparison by application
  • Exhibit 22: Smartphones - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 23: Smartphones - Year-over-year growth 2018-2022 (%)
  • Exhibit 24: SSD - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 25: SSD - Year-over-year growth 2018-2022 (%)
  • Exhibit 26: Memory cards - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 27: Memory cards - Year-over-year growth 2018-2022 (%)
  • Exhibit 28: Tablets - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 29: Tablets - Year-over-year growth 2018-2022 (%)
  • Exhibit 30: Others - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 31: Others - Year-over-year growth 2018-2022 (%)
  • Exhibit 32: Market opportunity by application
  • Exhibit 33: Technology- Market share 2017-2022 (%)
  • Exhibit 34: Comparison by technology
  • Exhibit 35: TLC - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 36: TLC - Year-over-year growth 2018-2022 (%)
  • Exhibit 37: MLC - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 38: MLC - Year-over-year growth 2018-2022 (%)
  • Exhibit 39: SLC - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 40: SLC - Year-over-year growth 2018-2022 (%)
  • Exhibit 41: Market opportunity by application
  • Exhibit 42: Type - Market share 2017-2022 (%)
  • Exhibit 43: Comparison by type
  • Exhibit 44: 2D NAND - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 45: 2D NAND - Year-over-year growth 2018-2022 (%)
  • Exhibit 46: 3D NAND - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 47: 3D NAND - Year-over-year growth 2018-2022 (%)
  • Exhibit 48: Market opportunity by type
  • Exhibit 49: Customer landscape
  • Exhibit 50: Global - Market share by geography 2017-2022 (%)
  • Exhibit 51: Regional comparison
  • Exhibit 52: Americas - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 53: APAC - Year-over-year growth 2018-2022 (%)
  • Exhibit 54: Americas - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 55: Americas - Year-over-year growth 2018-2022 (%)
  • Exhibit 56: EMEA - Market size and forecast 2017-2022 ($ bn)
  • Exhibit 57: EMEA - Year-over-year growth 2018-2022 (%)
  • Exhibit 58: Key leading countries
  • Exhibit 59: Market opportunity
  • Exhibit 60: Global smartphones and tablets shipments (millions of units)
  • Exhibit 61: Comparison of SSDs vs HDDs
  • Exhibit 62: Vendor landscape
  • Exhibit 63: Landscape disruption
  • Exhibit 64: Vendors covered
  • Exhibit 65: Vendor classification
  • Exhibit 66: Market positioning of vendors
  • Exhibit 67: Vendor overview
  • Exhibit 68: SAMSUNG - Business segments
  • Exhibit 69: SAMSUNG - Organizational developments
  • Exhibit 70: SAMSUNG - Geographic focus
  • Exhibit 71: SAMSUNG - Segment focus
  • Exhibit 72: SAMSUNG - Key offerings
  • Exhibit 73: Vendor overview
  • Exhibit 74: Toshiba - Business segments
  • Exhibit 75: Toshiba - Organizational developments
  • Exhibit 76: Toshiba - Geographic focus
  • Exhibit 77: Toshiba - Segment focus
  • Exhibit 78: Toshiba - Key offerings
  • Exhibit 79: Vendor overview
  • Exhibit 80: Toshiba - Business segments
  • Exhibit 81: SAMSUNG - Organizational developments
  • Exhibit 82: Western Digital - Geographic focus
  • Exhibit 83: Western Digital - Segment focus
  • Exhibit 84: Western Digital- Key offerings
  • Exhibit 85: Vendor overview
  • Exhibit 86: Micron Technology - Business segments
  • Exhibit 87: Micron Technology - Organizational developments
  • Exhibit 88: Micron Technology - Geographic focus
  • Exhibit 89: Western Digital - Segment focus
  • Exhibit 90: Micron Technology- Key offerings
  • Exhibit 91: Vendor overview
  • Exhibit 92: SK Hynix - Business segments
  • Exhibit 93: SK Hynix - Organizational developments
  • Exhibit 94: SK Hynix - Geographic focus
  • Exhibit 95: SK Hynix - Segment focus
  • Exhibit 96: SK Hynix - Key offerings
  • Exhibit 97: Vendor overview
  • Exhibit 98: Intel - Business segments
  • Exhibit 99: Intel - Organizational developments
  • Exhibit 100: Intel - Geographic focus
  • Exhibit 101: Intel - Segment focus
  • Exhibit 102: Intel- Key offerings
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