Die Bonding Machine Market Report: Trends, Forecast and Competitive Analysis to 2030

Die Bonding Machine Trends and Forecast

The future of the global die bonding machine market looks promising with opportunities in the consumer electronic, automotive, telecommunication, aerospace & defense, and medical markets. The global die bonding machine market is expected to reach an estimated $1.7 billion by 2030 with a CAGR of 5.5% from 2024 to 2030. The major drivers for this market are growing demand for semiconductor devices, increasing adoption of advanced packaging technologies, and risng trend of miniaturization in electronic devices.

A more than 150-page report is developed to help in your business decisions.

Die Bonding Machine by Segment

The study includes a forecast for the global die bonding machine by type, component, end use, and region.

Die Bonding Machine Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Fully Automatic
• Semi-Automatic
• Manual

Die Bonding Machine Market by Component [Shipment Analysis by Value from 2018 to 2030]:

• Controllers
• Dispensers
• Bonding Tools
• Pick-Up Tools
• Cameras

Die Bonding Machine Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

• Consumer Electronics
• Automotive
• Telecommunications
• Aerospace & Defense
• Medical
• Others

Die Bonding Machine Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Die Bonding Machine Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies die bonding machine companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the die bonding machine companies profiled in this report include-

• Besi
• ASM Pacific Technology
• Kulicke & Soffa
• Palomar Technologies
• Shinkawa
• DIAS Automation
• Toray Engineering
• Panasonic
• West-Bond
• Hybond

Die Bonding Machine Market Insights

Lucintel forecasts that fully automatic is expected to witness the highest growth over the forecast period.

Within this market, consumer electronic is expected to witness the highest growth due to growing adoption of consumer electronics such as smartphones, tablets, laptops, and other gadgets.

APAC will remain the largest region over the forecast period due to the region's strong electronics manufacturing base, particularly in China and South Korea.

Features of the Global Die Bonding Machine Market

Market Size Estimates: Die bonding machine market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Die bonding machine market size by type, component, end use, and region in terms of value ($B).

Regional Analysis: Die bonding machine market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, components, end uses, and regions for the die bonding machine market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the die bonding machine market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the die bonding machine market size?

Answer: The global die bonding machine market is expected to reach an estimated $1.7 billion by 2030.

Q2. What is the growth forecast for die bonding machine market?

Answer: The global die bonding machine market is expected to grow with a CAGR of 5.5% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the die bonding machine market?

Answer: The major drivers for this market are growing demand for semiconductor devices, increasing adoption of advanced packaging technologies, and risng trend of miniaturization in electronic devices.

Q4. What are the major segments for die bonding machine market?

Answer: The future of the die bonding machine market looks promising with opportunities in the consumer electronic, automotive, telecommunication, aerospace & defense, and medical markets.

Q5. Who are the key die bonding machine market companies?

Answer: Some of the key die bonding machine companies are as follows.

• Besi
• ASM Pacific Technology
• Kulicke & Soffa
• Palomar Technologies
• Shinkawa
• DIAS Automation
• Toray Engineering
• Panasonic
• West-Bond
• Hybond

Q6. Which die bonding machine market segment will be the largest in future?

Answer: Lucintel forecasts that fully automatic is expected to witness the highest growth over the forecast period.

Q7. In die bonding machine market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to the region's strong electronics manufacturing base, particularly in China and South Korea.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the die bonding machine market by type (fully automatic, semi-automatic, and manual), component (controllers, dispensers, bonding tools, pick-up tools, and cameras), end use (consumer electronics, automotive, telecommunications, aerospace & defense, medical, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?