PUBLISHER: Lucintel | PRODUCT CODE: 1418459
PUBLISHER: Lucintel | PRODUCT CODE: 1418459
Die Bonder Equipment Trends and Forecast
The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets. The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030 with a CAGR of 3.0% from 2024 to 2030. The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.
A more than 150-page report is developed to help in your business decisions.
Die Bonder Equipment by Segment
The study includes a forecast for the global die bonder equipment by type, bonding technique, device, application, and region.
List of Die Bonder Equipment Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies die bonder equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the die bonder equipment companies profiled in this report include-
Die Bonder Equipment Market Insights
Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.
APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.
Features of the Global Die Bonder Equipment Market
Market Size Estimates: Die bonder equipment market size estimation in terms of value ($M).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Die bonder equipment market size by bonding technique, device, application, and region in terms of value ($M).
Regional Analysis: Die bonder equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different type, bonding technique, device, application, and regions for the die bonder equipment market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the die bonder equipment market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
FAQ
Q1. What is the die bonder equipment market size?
Answer: The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030.
Q2. What is the growth forecast for die bonder equipment market?
Answer: The global die bonder equipment market is expected to grow with a CAGR of 3.0% from 2024 to 2030.
Q3. What are the major drivers influencing the growth of the die bonder equipment market?
Answer: The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.
Q4. What are the major segments for die bonder equipment market?
Answer: The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets.
Q5. Who are the key die bonder equipment market companies?
Answer: Some of the key die bonder equipment companies are as follows.
Q6. Which die bonder equipment market segment will be the largest in future?
Answer: Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.
Q7. In die bonder equipment market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.
Q.8 Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.