PUBLISHER: Mordor Intelligence | PRODUCT CODE: 2044104
PUBLISHER: Mordor Intelligence | PRODUCT CODE: 2044104
The Asia-Pacific data center cooling market size is expected to increase from USD 3.56 billion in 2025 to USD 4.09 billion in 2026 and reach USD 8.26 billion by 2031, growing at a CAGR of 15.09% over 2026-2031.

Accelerating adoption of generative-AI servers, mandatory efficiency codes such as China's PUE <= 1.3 rule and Singapore's SS 715:2025 standard, and hyperscale build-outs by Microsoft, Google, Alibaba, and Tencent are expanding demand for high-performance thermal systems. Liquid architectures are gaining traction because air-based cooling reaches economic and technical limits above 30 kW per rack, yet air solutions still dominate legacy estates and sub-30 kW deployments. Vendors that combine hardware, software, and rapid prefabrication are winning contracts as operators compress build schedules from 18 months to six. Supply-chain risk is easing after 2024 steel and semiconductor shortages, but HVAC-skilled labor gaps in Southeast Asia remain a near-term bottleneck.
Generative-AI clusters are lifting rack densities from 8-12 kW toward 40-60 kW, where air systems lose both cost and thermal headroom. Lenovo's Neptune direct-to-chip platform installed at NTT's Tokyo campus in 2025 saved 40% energy while supporting 50 kW racks, and China's 2024 code now obliges liquid cooling above 8 kW per cabinet. Singapore's updated SS 715 demands PUE < 1.2 for high-density halls.At densities beyond 30 kW, immersion designs eliminate chillers and cut total cost of ownership by up to 30%, although uptake is moderated by OEM warranty terms and a shortage of technicians versed in dielectric-fluid safety. The Asia-Pacific data center cooling market is therefore shifting capital toward pumps, plates, and heat-exchanger modules that underpin liquid loops.
Microsoft's USD 17.5 billion India program and Google's USD 15 billion Andhra Pradesh campus each require 200-300 MW of IT load, absorbing 15-20% of regional chiller output through 2027. Oracle's multi-country region specified six-month delivery of modular mechanical blocks, accelerating orders for Vertiv and Schneider Electric. Chinese giants Alibaba and Tencent added 180 MW in 2025, drawn by land subsidies in Guangdong and Jiangsu that are conditional on 50% renewable sourcing. The hyperscale wave bifurcates the vendor field, rewarding suppliers with liquid IP and balance-sheet strength capable of vendor financing.
Singapore's tariff climbed to SGD 0.35/kWh in 2025 (USD 0.26/kWh) and the city's land scarcity allocates only 300 MW of extra IT load through 2030, inflating plots above SGD 1,000 ft2 (USD 695 ft2). Tokyo inner districts exceed USD 15,000 m2, triggering capacity shifts to Osaka despite latency penalties. Similar pressures in Sydney and Hong Kong redirect builds toward outer suburbs or Guangdong, but grid and fiber gaps undermine quick scaling. Because air cooling can represent 40% of a facility's power bill versus 15% for liquid, cost inflation is nudging incumbents to retrofit direct-to-chip loops even on brownfield assets.
Other drivers and restraints analyzed in the detailed report include:
For complete list of drivers and restraints, kindly check the Table Of Contents.
Air-based systems delivered 59.96% revenue in 2025, supported by entrenched operational know-how and a vast installed base. Yet the Asia-Pacific data center cooling market size for liquid architectures is forecast to expand at a 16.13% CAGR as generative-AI racks exceed 40 kW, a density where rear-door exchangers and immersion tanks outrun fan-driven CRAC units. Immersion deployments at Keppel Data Centres achieved PUE 1.03 and removed chillers entirely, proving a 25% capex and 40% opex cut over air baselines. Direct-to-chip loops from CoolIT allowed 50 kW retrofits in Japanese and Australian halls, adding seven years to asset life.
Despite liquid's momentum, air cooling preserves tactical advantages below 30 kW, in climates with extended free-cooling windows, and in markets short on dielectric-fluid skills such as Indonesia and Vietnam. Daikin's magnetic-bearing chillers reached 0.45 kW per ton in Tokyo, sustaining air's relevance where water limits prohibit towers. The Asia-Pacific data center cooling market continues to reward hybrid estates that blend fan coils for low-density rows with pumped liquid loops for AI zones, easing migration paths for cautious operators.
Computer-room air handlers maintained 41.55% share in 2025, but demand is tilting toward pumps, valves, and plate heat exchangers that orchestrate liquid loops. Grundfos and Xylem introduced variable-speed pumps tailored to 35-60 °C water, securing Microsoft and Google contracts in India. Alfa Laval's Compabloc plates hit 95% heat-transfer efficiency inside immersion shells, driving multi-megawatt orders from Singapore and Tokyo.
Chillers bifurcate between high-efficiency magnetic-bearing units for air halls and compact skid exchangers for liquid districts. Monitoring software now grows fastest at roughly 17% CAGR, with Schneider Electric EcoStruxure IT and Vertiv Trellis trimming energy 10-15% via machine-learning set-point control. As liquid penetration deepens, the Asia-Pacific data center cooling market will progressively prize precision flow hardware over bulk air movers.
The Asia Pacific Data Center Cooling Market Report is Segmented by Cooling Technology (Air-Based, and Liquid-Based), Cooling Component (CRAH/CRAC, Chillers and Heat Exchangers, Cooling Towers and Dry Coolers, and More), Tier Type (Tier 1 and 2, and Tier 4), Data Center Size (Small, Medium, Large, and Hyperscale), Data Center Type (Colocation, and More), and Country. The Market Forecasts are Provided in Terms of Value (USD).