PUBLISHER: Mordor Intelligence | PRODUCT CODE: 2063933
PUBLISHER: Mordor Intelligence | PRODUCT CODE: 2063933
According to Mordor Intelligence, the china lED chips market size is projected to be USD 8.84 billion in 2025, USD 9.63 billion in 2026, and reach USD 16.08 billion by 2031, growing at a CAGR of 10.8% from 2026 to 2031.

This report is Segmented by LED Chip Technology (Conventional LEDs, Mini-LED, Micro-LED), Semiconductor Material (GaN/InGaN, Algainp, Other Semiconductor Materials), and Application (General Lighting, Automotive, Backlighting/Displays, Consumer Electronics, Industrial/Specialty Lighting). The Market Forecasts are Provided in Terms of Value (USD).
Phase III of the National IC Fund earmarked USD 47 billion in 2024, with 18% directed to compound semiconductors, lowering MOCVD reactor costs by up to 50% for qualified LED fabs.Provincial co-funding adds a further USD 8.5 billion, translating into rapid capacity gains and safeguarding near-term capital access. Subsidy recipients, however, must hit 90% domestic equipment usage and 15% annual productivity metrics by 2027, requirements that favor entrenched scale players. Sanan reported government grants equal to 22% of 2024 net income, underscoring continuing dependence. While the cash support accelerates volume, the performance thresholds strengthen the competitive moat around leaders and cull weaker entrants, shaping the medium-term structure of the China LED chips market.
Sanan and HC SemiTek expanded their combined GaN-on-Si fleet from 31 to 47 reactors between Q1 2025 and Q1 2026, attracted by 30-40% lower substrate cost and the die density gains inherent to 8-inch wafers.Buffer-layer engineering breakthroughs published in 2025 pushed yields to 91%, closing much of the gap with sapphire platforms. Although high-brightness segments still prefer sapphire for thermal reasons, GaN-on-Si enables low-cost lamps and mid-power backlighting, broadening addressable demand. Producers that master wafer bow management and thermal mismatch will unlock margin relief while extending the lifespan of conventional lines, thereby sustaining the growth momentum of the China LED chips market.
State-of-the-art laser or electrostatic transfer tools cost USD 12-18 million each yet deliver only 20-40% of the throughput that consumer economics require, pushing a single micro-LED line's capex above USD 50 million. Until tool speeds double and defect rates halve, mass-market wearables and TVs remain out of reach. For most domestic chipmakers, negative early-stage returns deter aggressive scaling, tempering the near-term uplift to the China LED chips market.
Other drivers and restraints analyzed in the detailed report include:
For complete list of drivers and restraints, kindly check the Table Of Contents.
Conventional LEDs generated 83% of 2025 revenue, anchoring the China LED chips market size despite 8-12% price compression. Mature 4-inch and 6-inch lines still deliver positive cash flow, subsidizing R&D into mini-LED and micro-LED. Mini-LED backlighting shipments reached 4.2 million TV units, translating into a significant uplift in die volumes. Should OLED panels fall below USD 300 for a 65-inch size by 2027, mini-LED could retrench to outdoor signage and professional monitors. Yet today's local dimming requirements and brightness advantages keep mini-LED on an expansion path that supports total unit growth in the China LED chips market.
Micro-LED, though contributing less than 2% of 2025 sales, is projected to grow at about 15.64% CAGR through 2031, the fastest among chip types. Wearable displays and automotive head-up units require the high brightness and extended lifetime that inorganic emitters provide. A 2025 Nature Photonics study validated efficiencies above 250 lm/W at sub-10 µm pitches, proving the physics while highlighting manufacturing hurdles. As mass-transfer improves, micro-LED could eventually shift revenue mix, but for the next three years, conventional LEDs will continue to bankroll technological migration across the China LED chips market.