PUBLISHER: QYResearch | PRODUCT CODE: 1862407
PUBLISHER: QYResearch | PRODUCT CODE: 1862407
The global market for Semiconductor Parts Cleaning was estimated to be worth US$ 970 million in 2024 and is forecast to a readjusted size of US$ 1495 million by 2031 with a CAGR of 6.3% during the forecast period 2025-2031.
Semiconductor chamber parts cleaning lagged behind the "Ultra-Clean Revolution" which is central in discussing all other semiconductor process inputs (i.e., gases, chemicals and silicon). Every other semiconductor process input has a Certificate of Analysis (COA)-even new parts. However, recycled chamber part cleanliness varies significantly in particle levels and atomic level contamination. This is partly because standard practice used the tools themselves to perform the final cleaning of the parts. Verifying cleanliness targets was achieved by using many test wafers, expensive wafer metrology and wasted production time. Cleaning is a process to remove contaminants such as particles and ionic impurities of equipment parts generated during customers' process.
This report studies the precision cleaning services for semiconductor chamber parts, include the used parts and new parts of ALD, CVD, PVD, Etch, diffusion, Ion Implantation, Lithography, and quartz, etc for fabs and OEMs.
The North America market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 104.86 million in 2024 to reach $ 155.27 million by 2031, at a CAGR of 5.66% during the forecast period of 2025 through 2031.
China Mainland market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 225.43 million in 2024 to reach $ 397.89 million by 2031, at a CAGR of 7.92% during the forecast period of 2025 through 2031.
South Korea market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 205.39 million in 2024 to reach $ 311.37 million by 2031, at a CAGR of 6.14% during the forecast period of 2025 through 2031.
China Taiwan market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 254.16 million in 2024 to reach $ 372.78 million by 2031, at a CAGR of 5.89% during the forecast period of 2025 through 2031.
Currently the 300mm equipment parts are the largest application, holds a share about 65.6 % in 2024. The 200mm market is driven by the demand from car chips, MEMS, sensors, power semiconductor devices. The 150mm market is mainly driven by demand from silicon carbide (SiC) devices. Last few years, the demand from semiconductor refurbished equipment also drives the growth of precision cleaning, especially in China market.
Currently Etching is the largest application, has a share about 41.7%, followed by Thin Film (CVD/PVD), and Diffusion.
The key players of cleaning service are mainly located in USA, Germany, Japan, South Korea, China Taiwan, Singapore and China Mainland. The global top 5 players hold a share about 44.4%, while top 10 players occupied nearly 72 percent.
Currently, in the United States, the key players are UCT (Ultra Clean Holdings, Inc), Pentagon Technologies, Enpro Industries, Mitsubishi Chemical (Cleanpart), Persys Group, MSR-FSR LLC and KoMiCo (USA division).
In South Korea players include KoMiCo, Cinos, Hansol IONES, WONIK QnC, and DFtech.
In China Taiwan, key players are Shih Her Technology, Frontken (Ares Green Technology Corporation), UCT (Tainan Quantum Technologies), Enpro Industries (LeanTeq), KERTZ HIGH TECH, Hung Jie Technology Corporation, Mitsubishi Chemical Taiwan, HTCSolar and KoMiCo, etc. The China Taiwan IC manufacturing is driven by demand from High Performance Computing (HPC), Smartphone, Internet of Things, Automotive, and Digital Consumer Electronics, etc. the Incremental demand is especially driven by the HPC chips for AI, data center, servers, 5G smartphones and automotive. TSMC is the largest customer of cleaning services in China Taiwan, and According to its data, In 2024, the TSMC advanced process (16nm to 3nm) revenue occupied for 80%, and is expected to reach over 84% in 2025.
In China mainland market, key players are TOCALO (China division, Kunshan), KoMiCo (China division, KoMiCo Technology (Wuxi) Limited.), Cinos (China division, Xi'an), WONIK QnC (China division, Xi'an), DFtech (China division, Wuxi), Hung Jie Technology Corporation (China division, Nanjing HungJie Semicondutor technology), Ferrotec (Anhui) Technology Development Co., Ltd, Chongqing Genori Technology Co., Ltd and Beijing GRAND HITEK, etc. In future, more Chinese new entrants will enter this market.
The cleaning service for semiconductor equipment parts has evolved into a mission-critical support sector as device geometries scale down to <5nm and front-end tools become increasingly sensitive to trace contamination. Globally, the industry is undergoing:
Outsourcing Growth: Leading IDMs and foundries increasingly outsource cleaning of CVD/ALD reactor parts, etch shields, electrostatic chucks, and gas delivery modules to certified service providers.
Localization Trend: China, and Southeast Asia are establishing localized cleaning centers to support new fab construction and reduce import dependency.
Fab Demand Diversification: Growth in advanced packaging (2.5D/3D), power semiconductors, and compound semiconductors (SiC, GaN) expands the variety and complexity of parts requiring specialized cleaning.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Parts Cleaning, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Semiconductor Parts Cleaning by region & country, by Equipment Size, and by Equipment Type.
The Semiconductor Parts Cleaning market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Parts Cleaning.
Market Segmentation
By Company
Segment by Equipment Size
Segment by Process Node
Segment by Equipment Type
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Semiconductor Parts Cleaning company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Equipment Size, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Equipment Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Semiconductor Parts Cleaning in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Semiconductor Parts Cleaning in country level. It provides sigmate data by Equipment Size, and by Equipment Type for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.