Hybrid Bonding Technology Portrays Essential Role as Advanced Packaging Continues to Evolve

The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation of computing performance for chips according to the Moore's Law. With that being said, the existing micro-bump bonding technology that could impede high-end chips from fully exerting their performance would have to be replaced by hybrid bonding. This report analyzes development trends of chiplet design and advanced packaging technology on the one hand, and probes into the necessity and development momentum of the hybrid bonding technology on future development of high-end chips on the other hand.